Full mirror light penetration;Latest ARGB (Addressable RGB) technology.
High-speed low latency performance.
Aluminum alloy heat sink with high performance.
Automatic overclocking;compatible with Intel and AMD motherboards (ASUS, GIGABYTE, MSI, ASROCK);Selected high-quality IC;OC profile support;energy saving with ultra-low working voltage;Visit www.teamgroupinc.com for more compatibility information.
16GB CL18 3600MHz Kit (2 x 8GB);CL18-22-22-42 latency;Data transfer bandwidth 28,800 MB / s (PC4 28800);Voltage 1.35 V;Dimensions 48.7 (height) x 133.7 (length) x 8.1 (width) mm;Non-ECC fered DIMM unbuffered module type
Full mirror light penetration;Latest ARGB (Addressable RGB) technology.
High-speed low latency performance.
Aluminum alloy heat sink with high performance.
Automatic overclocking;compatible with Intel and AMD motherboards (ASUS, GIGABYTE, MSI, ASROCK);Selected high-quality IC;OC profile support;energy saving with ultra-low working voltage;Visit www.teamgroupinc.com for more compatibility information.
16GB CL18 3600MHz Kit (2 x 8GB);CL18-22-22-42 latency;Data transfer bandwidth 28,800 MB / s (PC4 28800);Voltage 1.35 V;Dimensions 48.7 (height) x 133.7 (length) x 8.1 (width) mm;Non-ECC fered DIMM unbuffered module type